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Sistem Pemantauan Angular Velocity Berbasis Transmisi Fiber Optik 150 Km dengan Topologi Ring
Abstract
Penelitian ini merancang sistem pemantauan angular velocity berbasis sensor gyroscope yang terintegrasi dengan media transmisi kabel fiber optik sepanjang 150 km menggunakan topologi ring. Sistem ini bertujuan untuk menyediakan solusi pemantauan data orientasi dan pergerakan sudut secara real-time dengan tingkat keandalan yang tinggi, khususnya di wilayah dengan risiko gangguan elektromagnetik. Data hasil pengukuran sensor dikirimkan melalui jaringan kabel fiber optik menggunakan perangkat industrial Ethernet switch dan modul SFP, kemudian divisualisasikan dalam dashboard berbasis C#. Hasil implementasi menunjukkan bahwa sistem mampu mentransmisikan data tiga sumbu (X, Y, dan Z) secara stabil tanpa degradasi sinyal yang signifikan, serta memberikan notifikasi anomali secara langsung. Sistem ini berpotensi diterapkan pada aplikasi pemantauan struktur bawah laut dan sistem peringatan dini tsunami.
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This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
How to Cite
[1]
H. Kurnianto, “Sistem Pemantauan Angular Velocity Berbasis Transmisi Fiber Optik 150 Km dengan Topologi Ring”, simkom, vol. 10, no. 2, pp. 231-241, Jul. 2025.
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L. Tippe, L. Pilgrim, J. Froschl, dan H.-G. Herzog, “Modular Simulation of Zonal Architectures and Ring Topologies for Automotive Power Nets,” dalam 2021 IEEE Vehicle Power and Propulsion Conference (VPPC), IEEE, Okt 2021, hlm. 1–5. doi: 10.1109/VPPC53923.2021.9699179.
M. F. B. Azman, N. A. Bt. Hamid, dan A. B. Yahya, “Overview of Signal Integrity Simulation for SFP+ Interface Serial Links with Advanced Design System (ADS),” dalam 2020 IEEE 10th Symposium on Computer Applications & Industrial Electronics (ISCAIE), IEEE, Apr 2020, hlm. 68–72. doi: 10.1109/ISCAIE47305.2020.9108815.
C. Loapheang dan S. Sitjongsataporn, “Design of Small Form-factor Pluggable Reader using Arduino Board,” dalam 2020 International Conference on Power, Energy and Innovations (ICPEI), IEEE, Okt 2020, hlm. 209–212. doi: 10.1109/ICPEI49860.2020.9431389.
